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The low level of impurities in the crucible ensures critical wafer properties will be optimum.
- Low aluminum and boron are best for high resistivity targeting.
- Low alkaliis are best for low OISF tageting.
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Basic Chemistry
- 510, 520, 530
with low alkali from Momentive Exclusive High Purity Process
- 567. 577. 587
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Low aluminum and boron
- 512, 522, 532
with low alkali from Momentive Exclusive High Purity Process
- 568, 578, 588
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Back to Crucibles
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Momentive Performance Materials
